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封装品种

SOP Series

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Production Overview
Plastic Shrink Small Outline packaging (SSOP) is a principal package using SMD technology. It is widely used in low cost and manual applications. NFME offers SSOP165mil with 8lead counts.

The lead pitch is 1.778mm.

 

Application

Shrink Small Outline packages are considered one of the most established industry standard packages. SSOP is commonly used logic, memory, and micro-controllers.  found in applications such as automotive consumer and communications products.

 

Features

* JEDEC standard compliant or reference
* Wide choice of pad sizes to meet die size per customer lead frame design capability
* Pb-free process ready and Green Molding Compound

 

Design Rule

 

Minimum Ink Size: 20mil (500 um) diameter or non-ink with wafer mapping

Maximum Ink Height: 1mil(25um)

Minimum Sawing street width: 2.4mil (60um)

Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.

 

 

Pkg type

Pkg size

Wafer thickness

SSOP165mil

All

10~12 mil (250~300 um)

 

Wire Bond Rule

Wire size

Min. bond pad pitch

Min. bond pad opening

Wire loop control

 

50um (2.0mil)

200 um

150 um

Max. wire length
loop height

5000um
<300um

38um (1.5mil)

170 um

100um

Max. wire length
loop height

5000um
<300um

33 um (1.3mil)

150 um

90 um

Max. wire length
loop height

5000um
<300um

30 um (1.2mil)

150um

90 um

Max. wire length
loop height

5000um
<300um

25um (1.0mil)

70um

60um

Max. wire length
loop height

5000um
<300um

23um (0.9mil)

60 um

50um

Max. wire length
loop height

3000um
<300um

20 um (0.8mil)

60 um

50 um

Max. wire length
loop height

3000um
<300um

Package Outline

 

DIP/SkDIP/SDIP/HDIP (All units are in mm)

PKG TYPE

Lead count

Lead Pitch

Lead Width

LeadThickness

BD

POD

SSOP

8

1.778

0.46

0.25

DOWN

DOWN

SOP(SOIC)

7

1.27

0.42

0.20

DOWN

DOWN

SOP(SOIC)

8

1.27

0.42

0.20

DOWN

DOWN

SOP(SOIC)

10

0.9144

0.41

0.20

DOWN

DOWN

HSOP(HSOIC)

8

1.27

0.42

0.20

DOWN

DOWN

SOP

14

1.27

0.40

0.20

DOWN

DOWN

SOP

16

1.27

0.40

0.20

DOWN

DOWN

SOP

16

1.27

0.40

0.20

DOWN

DOWN

HSOP

16

1.27

0.40

0.20

DOWN

DOWN

SSOP

20

0.635

0.25

0.20

DOWN

DOWN

QSOP

24

0.635

0.25

0.20

DOWN

DOWN

SOP

8

Cu

0.45

0.15

DOWN

DOWN

SOP(EIAJ)

8

Cu

0.43

0.20

DOWN

DOWN

SOP

14

Alloy 42

0.45

0.15

DOWN

DOWN

SOP

16

Alloy 42

0.45

0.15

DOWN

DOWN

SOP

20

Cu

0.45

0.15

DOWN

DOWN

SOP

20

1.27

0.40

0.25

DOWN

DOWN

SOP

24

1.27

0.40

0.25

DOWN

DOWN

SOP

28

1.27

0.45

0.15

DOWN

DOWN

HSOP

28

0.80

0.35

0.25

DOWN

DOWN

SOP

32

1.27

0.40

0.20

DOWN

DOWN

HSOP

34

0.80

0.35

0.25

DOWN

DOWN

MSOP

8

0.65

0.30

0.15

DOWN

DOWN

MSOP

10

0.50

0.20

0.15

DOWN

DOWN

HMSOP

8

0.65

0.30

0.15

DOWN

DOWN

HMSOP

10

0.50

0.20

0.15

DOWN

DOWN

TSSOP

8

0.65

0.22

0.127

DOWN

DOWN

TSSOP

14

0.65

0.22

0.127

DOWN

DOWN

HTSSOP

14

0.65

0.22

0.127

DOWN

DOWN

HTSSOP(EP)

14

0.65

0.22

0.127

DOWN

DOWN

TSSOP

16

0.65

0.22

0.127

DOWN

DOWN

HTSSOP

16

0.65

0.22

0.127

DOWN

DOWN

TSSOP

20

0.65

0.22

0.127

DOWN

DOWN

HTSSOP

20

0.65

0.22

0.127

DOWN

DOWN

TSSOP

24

0.50

0.20

0.127

DOWN

DOWN

TSSOP

24

0.65

0.22

0.127

DOWN

DOWN

TSSOP

28

0.65

0.22

0.127

DOWN

DOWN

HTSSOP

28

0.65

0.22

0.127

DOWN

DOWN

TSSOP

30

0.50

0.20

0.127

DOWN

DOWN

HTSSOP

64

0.50

0.20

0.127

DOWN

DOWN

TSSOP

64

0.50

0.20

0.127

DOWN

DOWN

TSOP

48

0.50

0.20

0.15

DOWN

DOWN

 

Packing & Shipping

 

 

SSOP(Tube)

PKG TYPE

Lead count

QTY/Tube

Tube/Inner Box

SSOP

8

80

200