产品技术

封装品种

SOP Series

SSOP165mil

 

Production Overview
Plastic Shrink Small Outline packaging (SSOP) is a principal package using SMD technology. It is widely used in low cost and manual applications. NFME offers SSOP165mil with 8lead counts.

The lead pitch is 1.778mm.

 

Application

Shrink Small Outline packages are considered one of the most established industry standard packages. SSOP is commonly used logic, memory, and micro-controllers.  found in applications such as automotive consumer and communications products.

 

Features

* JEDEC standard compliant or reference
* Wide choice of pad sizes to meet die size per customer lead frame design capability
* Pb-free process ready and Green Molding Compound

 

Design Rule

 

Minimum Ink Size: 20mil (500 um) diameter or non-ink with wafer mapping

Maximum Ink Height: 1mil(25um)

Minimum Sawing street width: 2.4mil (60um)

Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.

 

 

Pkg type

Pkg size

Wafer thickness

SSOP165mil

All

10~12 mil (250~300 um)

 

Wire Bond Rule

Wire size

Min. bond pad pitch

Min. bond pad opening

Wire loop control

 

50um (2.0mil)

200 um

150 um

Max. wire length
loop height

5000um
<300um

38um (1.5mil)

170 um

100um

Max. wire length
loop height

5000um
<300um

33 um (1.3mil)

150 um

90 um

Max. wire length
loop height

5000um
<300um

30 um (1.2mil)

150um

90 um

Max. wire length
loop height

5000um
<300um

25um (1.0mil)

70um

60um

Max. wire length
loop height

5000um
<300um

23um (0.9mil)

60 um

50um

Max. wire length
loop height

3000um
<300um

20 um (0.8mil)

60 um

50 um

Max. wire length
loop height

3000um
<300um

Package Outline

 

DIP/SkDIP/SDIP/HDIP (All units are in mm)

PKG TYPE

Lead count

Lead Pitch

Lead Width

LeadThickness

BD

POD

SSOP

8

1.778

0.46

0.25

DOWN

DOWN

 

Packing & Shipping

 

 

SSOP(Tube)

PKG TYPE

Lead count

QTY/Tube

Tube/Inner Box

SSOP

8

80

200