产品技术

封装品种

DIP Series

DIP300mil

 

Production Overview

Plastic dual-in-line packaging (PDIP) is a principal package using the pin-through-hole PTH technology. It is widely used in low cost and manual applications. NFME offers DIP300mil with lead counts ranging from 8 to 24 leads.  For package size reduction, NFME offers a alternatives-the narrow body type , Skinny DIP---SKDIP ( width is 300mil, lead counts is 24 ) and the narrow lead pitch type, Shrink DIP--- SDIP ( lead pitch is 1.778mm or 70mil, lead count is 24). AlsoNFME offers the type with heat sink ---HDIP or DIPT.

 

Application

Dual-in-line packages are considered one of the most established industry standard packages. DIP is commonly used logic, memory, and micro-controllers. found in applications such as automotive consumer and communications products.

 

Features

* JEDEC standard compliant or reference
* Wide choice of pad sizes to meet die size per customer lead frame design capability
* Pb-free process ready and Green Molding Compound

 

Design Rule

Minimum Ink Size: 20mil (500 um) diameter or non-ink with wafer mapping

Maximum Ink Height: 1mil(25um)

Minimum Sawing street width: 2.4mil (60um)

 

Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.

 

Pkg type

Pkg size

Wafer thickness

DIP/SDIP/HDIP

All

10~16.8 mil (250~420 um)

 

Wire Bond Rule

 

Wire size

Min. bond pad pitch

Min. bond pad opening

Wire loop control

 

50um (2.0mil)

200 um

150 um

Max. wire length
loop height

5000um
<400um

38um (1.5mil)

170 um

100um

Max. wire length
loop height

5000um
<400um

33 um (1.3mil)

150 um

90 um

Max. wire length
loop height

5000um
<400um

30 um (1.2mil)

150um

90 um

Max. wire length
loop height

5000um
<400um

25um (1.0mil)

70um

60um

Max. wire length
loop height

5000um
<400um

23um (0.9mil)

60 um

50um

Max. wire length
loop height

3000um
<400um

20 um (0.8mil)

60 um

50 um

Max. wire length
loop height

3000um
<400um

Package Outline

 

DIP/SkDIP/SDIP/HDIP (All units are in mm)

PKG TYPE

Lead count

Lead Pitch

Lead Width

LeadThickness

BD

POD

DIP

7

2.54

0.46

0.25

DOWN

DOWN

DIP7-M(P7)

7

2.54

0.46

0.25

DOWN

DOWN

DIP

8

2.54

0.46

0.25

DOWN

DOWN

DIP8-M

8

2.54

0.46

0.25

DOWN

DOWN

HDIP

12

2.54

0.46

0.25

DOWN

DOWN

DIP

14

2.54

0.46

0.25

DOWN

DOWN

DIPT

14

2.54

0.50

0.30

DOWN

DOWN

DIP

16

2.54

0.46

0.25

DOWN

DOWN

DIP16-M

16

2.54

0.46

0.25

DOWN

DOWN

HDIP

16

2.54

0.46

0.25

DOWN

DOWN

DIP

18

2.54

0.46

0.25

DOWN

DOWN

DIP

20

2.54

0.46

0.25

DOWN

DOWN

SDIP

24

1.778

0.43

0.25

DOWN

DOWN

SKDIP

24

2.54

0.46

0.25

DOWN

DOWN

 

 

Packing & Shipping(Tube)

DIP/SkDIP/SDIP/HDIP/DIPT

PKG TYPE

Lead count

QTY/Tube

Tube/Inner Box

DIP

8

50

40

HDIP

12

25

40

DIP

14

25

40

DIPT

14

20

40

DIP

16

25

40

HDIP

16

25

40

DIP

18

20

40

DIP

20

18

40

SDIP

24

20

40

SKDIP

24

16

40